Santa Barbara, CA, United States of America

Alok Paranjpye

This inventor holds 8 USPTO granted patents and 1 EPO patent. Top assignee: Innovative Micro Technology. Active years: 2009-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Alok Paranjpye. Retrieved from https://idiyas.com/inventor/alok-paranjpye

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 75.0


Average Co-Inventor Count = 3.2

ph-index = 4

Forward Citations = 41(Granted Patents)


Location History:

  • Santa Barbara, CA (US) (2009 - 2012)
  • Dallas, TX (US) (2014)

Company Filing History:


Years Active: 2009-2014

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8 patents (USPTO):Explore Patents

Title: Alok Paranjpye: Innovator in Hermetic Sealing Technologies

Introduction

Alok Paranjpye is a prominent inventor based in Santa Barbara, California. He has made significant contributions to the field of encapsulated devices, particularly through his innovative approaches to hermetic sealing technologies. With a total of eight patents to his name, Paranjpye continues to push the boundaries of engineering and materials science.

Latest Patents

One of Alok Paranjpye's latest patents is focused on a wafer-level hermetic bond using a metal alloy with a keeper layer. This invention outlines systems and methods for forming an encapsulated device that includes a hermetic seal, which effectively seals an insulating environment between two substrates. One of these substrates supports the device, and the hermetic seal is created by an alloy of two metal layers. At least one substrate may feature a raised component formed beneath one of the metal layers. The two metals can form an alloy with a predefined stoichiometry in at least two locations on either side of the raised feature, enhancing the hermeticity of the seal.

Another notable patent by Paranjpye also revolves around the wafer-level hermetic bond using a metal alloy with a keeper layer. This invention describes systems and methods for forming an encapsulated device that includes a hermetic seal, which seals an insulating environment between two substrates. One of the metal layers may have a diffusion barrier layer and a 'keeper' layer formed over it. The keeper layer confines the metal to a specific area, allowing substrate components to be heated for surface cleaning without activating the bonding mechanism.

Career Highlights

Alok Paranjpye is currently associated with Innovative Micro Technology, where he applies his expertise in developing advanced microfabrication techniques. His work has been instrumental in enhancing the reliability and performance of encapsulated devices, making significant strides in the industry.

Collaborations

Throughout his career, Paranjpye has collaborated with notable colleagues, including Jeffery Frank Summers and Douglas L Thompson. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Alok Paranjpye stands out as a key figure in the realm of hermetic sealing technologies. His innovative patents and contributions to the field continue to shape the future of encapsulated devices.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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