The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 04, 2011

Filed:

Feb. 08, 2008
Applicants:

John S. Foster, Santa Barbara, CA (US);

Paulo Silveira Da Motta, Santa Barbara, CA (US);

Alok Paranjpye, Santa Barbara, CA (US);

Kimon Rybnicek, Santa Barbara, CA (US);

Inventors:

John S. Foster, Santa Barbara, CA (US);

Paulo Silveira da Motta, Santa Barbara, CA (US);

Alok Paranjpye, Santa Barbara, CA (US);

Kimon Rybnicek, Santa Barbara, CA (US);

Assignee:

Innovative Micro Technology, Goleta, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01H 51/22 (2006.01);
U.S. Cl.
CPC ...
Abstract

Systems and methods for forming an electrostatic MEMS plate switch include forming a deformable plate on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. The deformable plate may have a flexible shunt bar which has one end coupled to the deformable plate, and the other end coupled to a contact on the second substrate. Upon activating the switch, the deformable plate urges the shunt bar against a second contact formed in the second substrate, thereby closing the switch. The hermetic seal may be a gold/indium alloy, formed by heating a layer of indium plated over a layer of gold. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate.


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