Company Filing History:
Years Active: 1980-1984
Title: Alfred Roesch: Innovator in Semiconductor Technology
Introduction
Alfred Roesch is a notable inventor based in Auburn, NY (US), recognized for his contributions to semiconductor technology. With a total of five patents to his name, Roesch has made significant advancements in the field, particularly in the area of thermal management for semiconductor devices.
Latest Patents
Roesch's latest patents include a thermal stress relieving bimetallic plate, which serves as a thermal matching element. This innovative component exhibits high electrical and thermal conductivity, facilitating the connection between heat-generating semiconductor devices and heat-transmissive electrically conductive members. The design allows for independent selection of the thermal matching element in different directions on the matching surface. Another significant patent is for a semiconductor package that features a strengthening and sealing upper chamber. This design includes a hermetically sealed chamber with a thermally conductive base and a rigid housing, which houses electrical terminals and is filled with a sealing and strengthening layer to enhance the strength and hermeticity of the package.
Career Highlights
Alfred Roesch has built a distinguished career at General Electric Company, where he has been instrumental in developing innovative solutions for semiconductor applications. His work has not only advanced the technology but has also contributed to the overall efficiency and reliability of semiconductor devices.
Collaborations
Throughout his career, Roesch has collaborated with talented individuals such as Mike F Chang and Julie Y Fichot. These partnerships have fostered a creative environment that has led to the successful development of groundbreaking technologies.
Conclusion
Alfred Roesch's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in thermal management and semiconductor packaging, showcasing the importance of innovation in technology.