Villach, Austria

Alexander Pfeuffer

This inventor holds 3 USPTO granted patents. Top assignee: Lam Research Ag. Active years: 2010-2013.


% Patents Active = 33.3

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2010-2013

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3 patents (USPTO):Explore Patents

Title: Alexander Pfeuffer: Innovator in Wet Treatment Technologies

Introduction

Alexander Pfeuffer is a notable inventor based in Villach, Austria. He has made significant contributions to the field of wet treatment technologies, particularly in the processing of disc-like substrates. With a total of 3 patents to his name, Pfeuffer continues to push the boundaries of innovation in his field.

Latest Patents

Pfeuffer's latest patents include a device and method for wet treating disc-like substrates. This innovative method involves a first plate and a second plate that are substantially parallel to each other. A wafer is held between these plates during treatment. A first dispenser introduces fluid into a first gap between the first plate and the wafer, while a second dispenser introduces fluid into a second gap between the second plate and the wafer. Additionally, at least one vibrating element is acoustically coupled to the second plate, allowing for enhanced treatment efficiency. The holder and the second plate can be rotated relative to each other about an axis that is substantially perpendicular to the second plate.

Career Highlights

Pfeuffer is currently employed at Lam Research AG, where he applies his expertise in developing advanced technologies for wafer treatment. His work has been instrumental in improving processes that are critical to the semiconductor industry.

Collaborations

Some of his notable coworkers include Martin Köffler and Alexander Lippert, who collaborate with him on various projects within the company.

Conclusion

Alexander Pfeuffer is a distinguished inventor whose work in wet treatment technologies has made a significant impact in the semiconductor field. His innovative patents and contributions continue to shape the future of wafer processing.

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