Lam Research Ag

Alexander Pfeuffer

Rainer Obweger

Alexander Lippert

Martin Köffler

A method for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.

Device and method for wet treating disc-like substrates

A device for wet treatment of wafers includes a first plate and a second plate substantially parallel to the first plate, and a wafer is held between the first and the second plate substantially parallel. A first dispenser introduces fluid into a first gap between the first plate and the wafer when being treated, and a second dispenser introduces fluid into a second gap between the second plate and the wafer when being treated. At least one vibrating element is acoustically coupled to at least the second plate, and a holder and the second plate are rotated relative to each other about an axis substantially perpendicular to the second plate.

Method for cleaning a surface is disclosed comprising a cleaning step with an aqueous cleaning medium, which is supplied to said semiconductor surface wherein the cleaning medium comprises cleaning particles suspended in a colloidal form and mechanical agitation is applied to the particles to be removed for at least part of the time during the cleaning step.

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Villach, Austria

Alexander Pfeuffer