Alexander Fluegel

This inventor holds 17 USPTO granted patents and 11 published patent applications and 12 EPO patents. Top assignee: Basf Se Corporation. Active years: 2017-2026.

USPTO Granted Patents = 17 (Patent Applications = 11)

% Patents Active = 100.0

EPO Patents = 12 (Patent Applications = 23)

Average Co-Inventor Count = 4.8

ph-index = 2

Forward Citations = 11(Granted Patents)

Location History:

Bad Duerkheim, DE (2017)
Ludwigshafen, DE (2022 - 2024)

Company Filing History:

17 out of 5,890

Basf Se Corporation

patents

Years Active: 2017-2026

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17 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12606925 - Composition for copper bump electrodeposition comprising a leveling agent (2026-04-21),

2. 12559852 - Composition for tin-silver alloy electroplating comprising a complexing agent (2026-02-24),

3. 12522936 - Polyalkanolamines (2026-01-13),

4. 12509790 - Composition for tin or tin alloy electroplating comprising leveling agent (2025-12-30),

5. 12134834 - Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent (2024-11-05),

6. 12098473 - Composition for cobalt plating comprising additive for void-free submicron feature filling (2024-09-24),

7. 12054842 - Composition for tin-silver alloy electroplating comprising a complexing agent (2024-08-06),

8. 11926918 - Composition for metal plating comprising suppressing agent for void free filing (2024-03-12),

9. 11840771 - Composition for tin or tin alloy electroplating comprising suppressing agent (2023-12-12),

10. 11535946 - Composition for tin or tin alloy electroplating comprising leveling agent (2022-12-27),

11. 11459665 - Composition for tin or tin alloy electroplating comprising suppressing agent (2022-10-04),

12. 11387108 - Composition for metal electroplating comprising leveling agent (2022-07-12),

13. 11377748 - Composition for cobalt electroplating comprising leveling agent (2022-07-05),

14. 11242606 - Composition for tin or tin alloy electroplating comprising suppressing agent (2022-02-08),

15. 9758885 - Composition for metal electroplating comprising leveling agent (2017-09-12),

Title: The Innovative Contributions of Alexander Fluegel

Introduction

Alexander Fluegel is a prominent inventor based in Ludwigshafen, Germany. He has made significant contributions to the field of materials science, particularly in the area of electrodeposition. With a total of 17 patents to his name, Fluegel continues to push the boundaries of innovation in his field.

Latest Patents

Fluegel's latest patents include a composition for copper bump electrodeposition that comprises a polyaminoamide type leveling agent. This composition includes copper ions, an acid, and at least one polyaminoamide with specific structural components. Another notable patent is for a composition for cobalt plating that includes an additive for void-free submicron feature filling. This composition consists of cobalt ions and a specific suppressing agent that ensures void-free bottom-up filling of nanometer-sized recessed features.

Career Highlights

Fluegel's career is marked by his work at BASF SE Corporation, where he has been instrumental in developing innovative materials and processes. His expertise in electrodeposition has made him a key figure in advancing technologies that are critical for various applications in electronics and materials engineering.

Collaborations

Throughout his career, Fluegel has collaborated with several talented individuals, including Marco Arnold and Charlotte Emnet. These collaborations have fostered a creative environment that has led to groundbreaking advancements in their respective fields.

Conclusion

Alexander Fluegel's contributions to innovation and technology are noteworthy, and his patents reflect his commitment to advancing materials science. His work continues to influence the industry and inspire future innovations.