Basf Se Corporation

Alexander Fluegel

Marco Arnold

Charlotte Emnet

Dieter Mayer

Marcel Patrik Kienle

Nadine Engelhardt

Cornelia Roeger-Goepfert

Roman Benedikt Raether

Alexandra Haag

Lucas Benjamin Henderson

Soichi Watanabe

Katharina Fritzsche

Michael Siemer

Jean-Pierre Berkan Lindner

Doris Kremzow-Graw

Nicole Meier

Sabine Frischhut

Sathana Kitayaporn

Jan Niclas Gorges

Robert Braendle

Verena Strempel

Elisabeth Kuttner

Disclosed herein is an aqueous composition including tin ions, optionally alloy metal ions selected from the group consisting of silver, indium, and bismuth ions and at least one additive of formula L1a or of formula L1b

Composition for tin or tin alloy electroplating comprising leveling agent

Described herein is a composition including copper ions, an acid, and at least one polyaminoamide including, a group of formula L1[A-B-A'-Z][Y—Z]  (L1)whereB is a diacid fragment of formula L2 A, A' are amine fragments independently selected from the group consisting of formula L3a Y is a co-monomer fragment;Z is a coupling fragment of formula L4 n is an integer of from 1 to 400; andm is 0 or an integer of from 1 to 400.

Composition for copper bump electrodeposition comprising a polyaminoamide type leveling agent

Described herein is a composition including metal ions consisting essentially of cobalt ions, and a specific monomeric and polymeric suppressing agent including a carboxylic, sulfonic, sulfinic, phosphonic, or phosphinic acid functional groups which show a suppressing effect that is required for void-free bottom-up filling of nanometer-sized recessed features.

Composition for cobalt plating comprising additive for void-free submicron feature filling

An aqueous composition comprising (a) metal ions comprising tin ions and silver ions and (b) at least one complexing agent of formula (C1) R—X—S—X[D-X—]—S—X—R, (C2) R—X—S—X-D-[X—S—]X—R, (C3) R—X—S—X-[D-X—]S—X—Rwherein X, Xare independently selected from a linear or branched C-Calkanediyl, which may be unsubstituted or substituted by OH; X, Xare independently selected from X, which may be further substituted by —X—COOR, —X—SO—O—R, a Cto Cpolyoxyalkylene group of formula —(O—CH—CHR)—OH, or a combination thereof, and —X—NH—CO—X—CO—NH—X—; X, Xare independently selected from a chemical bond and X; X, Xare independently selected from X; Xis a linear or branched Ci to C10 alkyl; Xis selected from Xand a divalent 5 or 6 membered aromatic group; R, Rare independently selected from a monovalent 5 or 6 membered aromatic N-heterocyclic group comprising one N atom or two N atoms which are separated by at least one C atom, and its derivatives received by N-alkylation with a C-C-alkyl group, which may be substituted by —COORor —SO—O—R, and which aromatic N-heterocyclic group may optionally further comprise, under the proviso that X21 is substituted by at least one OH, one S atom; R, Rare independently selected from a monovalent 5 or 6 membered aliphatic N-heterocyclic group comprising one N atom and one O atom; Dis independently selected from S, O and NR; Dis (a) a divalent 5 or 6 membered aliphatic heterocyclic ring system comprising 1 or 2 S atoms, or (b) a 5 or 6 membered aromatic heterocyclic ring system comprising at least two N atoms and optionally one or two S atoms; Dis independently selected from S and NR; n is an integer of from 0 to 5; z is an integer from 1 to 50; Ris selected from H and a linear or branched C-Calkyl; Ris selected from H and a linear or branched Cto Calkyl; and Ris selected from R10 and a cation.

Composition for tin-silver alloy electroplating comprising a complexing agent

The invention relates to a polyamine-based or polyhydric alcohol-based suppressing agent. The suppressing agent is modified by reaction with a compound that introduces a branching group into the suppressing agent before they are reacted with an alkylene oxide. The suppressing agent shows extraordinary superfilling properties, particularly when used to fill in features having extremely small aperture sizes and/or high aspect ratios.

Composition for metal plating comprising suppressing agent for void free filing

Described herein is an aqueous composition including tin ions and at least one compound of formula I

Composition for tin or tin alloy electroplating comprising suppressing agent

The present invention relates to the use of an aqueous composition comprising tin ions optionally further alloy metal ions selected from silver, copper, indium, and bismuth ions and at least one additive comprising a linear or branched polyimidazolium compound comprising the structural unit of formula (L1) for depositing tin or tin alloy containing layers and a process for depositing tin alloy layer onto a substrate. 

Described herein is an aqueous composition including tin ions and at least one compound of formula I where

A composition for metal plating comprising a source of metal ions and at least one leveling agent comprising at least one polyaminoamide comprising a polymer fragment of formula (I) or derivatives thereof obtainable by complete or partial protonation or N-quarternisation. 

Composition for metal electroplating comprising leveling agent

A cobalt electrodeposition composition comprising cobalt ions, and particular leveling agents comprising X&#x2014;CO&#x2014;O&#x2014;R, X&#x2014;SO&#x2014;O&#x2014;R, X&#x2014;PO(OR), X&#x2014;SO&#x2014;O&#x2014;Rfunctional groups, wherein Xis a divalent group selected from (i) a chemical bond (ii) aryl, (iii) Cto Calkandiyl, which may be interrupted by O atoms, (iv) an arylalkyl group &#x2014;X&#x2014;X&#x2014;, (v) an alkylaryl group &#x2014;X&#x2014;X&#x2014;, and (vi) &#x2014;(O&#x2014;CHR)O&#x2014;, Ris selected from H and Cto Calkyl. Ris selected from H and Cto Calkyl, Xis a divalent aryl group, Xis a divalent Cto Calkandiyl group.

Composition for cobalt electroplating comprising leveling agent

The present invention provides an aqueous composition comprising tin ions and at least one compound of formula I wherein Xis selected from a linear or branched C-Calkanediyl, which may optionally be interrupted by O or S or a Cto Caromatic moiety, Ris a copolymer of ethylene oxide and a further Cto Calkylene oxide, wherein the content of ethylene oxide is from 5 to 30% by weight, Ris selected from H, R, R, R, R, are (a) independently selected from H, R, R, or (b) may together form a divalent group X; Xis selected from a linear or branched C-Calkanediyl, which may optionally be interrupted by O, S or NR; Ris H or a linear or branched C-Calkyl, Ris selected from H, Rand a linear or branched C-Calkyl. 

A composition comprising a source of metal ions and at least one additive comprising at least one polyaminoamide, said polyaminoamide comprising the structural unit represented by formula I or derivatives of the polyaminoamide of formula I obtainable by complete or partial protonation, N-functionalization or N-quaternization with a non-aromatic reactant,wherein

A composition comprising a source of metal ions and at least one leveling agent comprising a linear or branched, polymeric imidazolium compound comprising the structural unit of formula L1 (L1) wherein R, R, Rare each independently selected from an H atom and an organic radical having from 1 to 20 carbon atoms, R4 is a divalent, trivalent or mutlivalent organic radical which does not comprise a hydroxyl group in the a or &#x3b2; position relative to the nitrogen atom of the imidazole rings is an integer. 

A composition comprising a source of metal ions and at least one polyaminoamide, said polyaminoamide comprising amide and amine functional groups in the polymeric backbone and aromatic moieties attached to or located within said polymeric backbone.

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Ludwigshafen, Germany

Alexander Fluegel