This inventor holds 2 USPTO granted patents and 2 published patent applications. Top assignee: Intel Corporation. Active years: 2020-2022.
Company Filing History:
Years Active: 2020-2022
Title: Albert S Lopez: Innovator in Electronic Packaging
Introduction
Albert S Lopez is a prominent inventor based in Tempe, AZ (US). He has made significant contributions to the field of electronic packaging, holding a total of 2 patents. His work focuses on innovative solutions that enhance the functionality and efficiency of electronic devices.
Latest Patents
Albert's latest patents include "TSV-less die stacking using plated pillars/through mold interconnect" and "Flexible packaging for a wearable electronic device." The first patent describes a device package that features substrates stacked on top of one another, with interconnects that electrically couple the surfaces of these substrates. This design incorporates pillars and adhesive layers to improve connectivity and structural integrity. The second patent presents a stretchable packaging system for wearable electronic devices, which includes a first electronic component and a flexible trace. An elastomer layer encapsulates these components, varying in thickness to provide optimal protection and flexibility.
Career Highlights
Albert S Lopez is currently employed at Intel Corporation, where he continues to push the boundaries of electronic packaging technology. His innovative approach has led to advancements that are crucial for the development of modern electronic devices.
Collaborations
Some of Albert's notable coworkers include Shawna M Liff and Preston T Meyers, who contribute to the collaborative environment at Intel Corporation.
Conclusion
Albert S Lopez is a key figure in the realm of electronic packaging, with a focus on innovative solutions that enhance device performance. His contributions through patents and collaboration with colleagues underscore his impact on the industry.