Intel Corporation

Albert S Lopez

Shawna M Liff

Johanna M Swan

Adel A Elsherbini

Aleksandar Aleksov

Srinivas V Pietambaram

Joshua Heppner

Dilan Seneviratne

Javier A Falcon

Nadine L Dabby

Rajat Goyal

Preston T Meyers

Joe R Saucedo

Son V Nguyen

David B Lampner

A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.

TSV-less die stacking using plated pillars/through mold interconnect

The document discloses a stretchable packaging system for a wearable electronic device. The system includes a first electronic component and a flexible trace connected to the first electronic component. An elastomer layer having a variable thickness at least partially encapsulates the first electronic component and the flexible trace. A first region of the layer has a first thickness that is greater than a second thickness of a second region of the layer that at least partially encapsulates the trace.

Flexible packaging for a wearable electronic device

Growing community of inventors

Tempe, AZ, United States of America

Albert S Lopez