The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Sep. 30, 2017
Intel Corporation, Santa Clara, CA (US);
Preston T. Meyers, Chandler, AZ (US);
Javier A. Falcon, Chandler, AZ (US);
Shawna M. Liff, Scottsdale, AZ (US);
Joe R. Saucedo, Phoenix, AZ (US);
Adel A. Elsherbini, Chandler, AZ (US);
Albert S. Lopez, Tempe, AZ (US);
Johanna M. Swan, Scottsdale, AZ (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
A device package has substrates disposed on top of one another to form a stack, and pads formed on at least one of the top surface and the bottom surface of each of the substrates. The device package has interconnects electrically coupling at least one of the top surface and the bottom surface of each substrate to at least one of the top surface and the bottom surface of another substrate. The device package has pillars disposed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates. The device package also has adhesive layers formed between at least one of the top surface and the bottom surface of one or more substrates to at least one of the top surface and the bottom surface of other substrates.