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For the Inventor, By the Inventor

Boise, ID, United States of America

Akshay N Singh

This inventor holds 16 USPTO granted patents and 41 published patent applications, primarily in Semiconductor Device Assembly. Top assignee: Micron Technology Incorporated. Active years: 2018-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akshay N Singh. Retrieved from https://idiyas.com/inventor/akshay-n-singh

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 16 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 2

Forward Citations = 14(Granted Patents)


Company Filing History:

goldMedal16 out of 39,294 
 
Micron Technology Incorporated
 patents

Years Active: 2018-2025

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Areas of Expertise:
Semiconductor
Die Assembly
Hybrid Bonding
Pillar Array
Interconnect
Shingled Stacks
Chip Scale Package
Memory Package
High Density
Device Assembly
Conversion
Bond Pads
16 patents (USPTO):Explore Patents
1. 12424590 - Semiconductor device assemblies and associated methods (2025-09-23),
2. 12278202 - Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods (2025-04-14),
3. 12255163 - Bond pads for semiconductor die assemblies and associated methods and systems (2025-03-18),
4. 12191162 - Semiconductor device assembly with pillar array (2025-01-07),
5. 11973062 - High density pillar interconnect conversion with stack to substrate connection (2024-04-30),
6. 11631644 - High density pillar interconnect conversion with stack to substrate connection (2023-04-18),
7. 11587912 - High density pillar interconnect conversion with stack to substrate connection (2023-02-21),
8. 11094670 - Semiconductor device assemblies including multiple shingled stacks of semiconductor dies (2021-08-17),
9. 11088114 - High density pillar interconnect conversion with stack to substrate connection (2021-08-10),
10. 10998271 - High density pillar interconnect conversion with stack to substrate connection (2021-05-04),
11. 10943794 - Semiconductor device assembly with pillar array and test ability (2021-03-09),
12. 10529592 - Semiconductor device assembly with pillar array (2020-01-07),
13. 10522507 - Semiconductor device assemblies including multiple shingled stacks of semiconductor dies (2019-12-31),
14. 10366934 - Face down dual sided chip scale memory package (2019-07-30),
15. 10312219 - Semiconductor device assemblies including multiple shingled stacks of semiconductor dies (2019-06-04),

Title: **Akshay N Singh: A Pioneer in Semiconductor Innovations**

Introduction

Akshay N Singh is a prominent inventor based in Boise, ID, USA, renowned for his significant contributions to the field of semiconductor technology. With a remarkable portfolio that includes 15 patents, Singh has established himself as a key figure in advancing innovative methods and systems within the semiconductor industry.

Latest Patents

Among Singh's latest inventions are two notable patents:

1. **Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods** - This patent describes a stacked semiconductor assembly comprising a lowermost die along with two or more modules held by its upper surface. Each module includes a base die and one or more upper dies. The design facilitates hybrid bonding between adjacent dies, allowing for various footprint configurations, enhancing the modular construction's versatility.

2. **Bond pads for semiconductor die assemblies and associated methods and systems** - In this patent, Singh outlines a semiconductor die assembly featuring a first semiconductor die with a bond pad on one side, aligned and bonded to a second semiconductor die's bond pad. The innovative design employs different metals at the bonding interface, contributing to the improved efficiency of semiconductor die assemblies.

Career Highlights

Akshay N Singh's career is marked by his role at Micron Technology Incorporated, a leading company in memory and storage solutions. His work focuses on enhancing semiconductor technologies, where he has played a vital role in developing cutting-edge solutions that address industry challenges. His contributions reflect a commitment to innovation and performance optimization in semiconductor design.

Collaborations

Singh collaborates with talented colleagues such as Owen R Fay and Kyle K Kirby at Micron Technology Incorporated. Together, they work on revolutionary projects that push the boundaries of semiconductor technology, fostering a culture of teamwork and creativity within their research environment.

Conclusion

In summary, Akshay N Singh's impactful inventions and collaborations have significantly advanced the semiconductor industry. His commitment to innovation and the development of efficient semiconductor technologies positions him as a leading figure in this field, paving the way for future advancements that will shape the electronics landscape.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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