Growing community of inventors

Boise, ID, United States of America

Akshay N Singh

Average Co-Inventor Count = 2.99

ph-index = 2

The patent ph-index is calculated by counting the number of publications for which an author has been cited by other authors at least that same number of times.

Forward Citations = 13

Akshay N SinghKyle K Kirby (8 patents)Akshay N SinghOwen R Fay (8 patents)Akshay N SinghHong Wan Ng (3 patents)Akshay N SinghBharat Bhushan (3 patents)Akshay N SinghBret K Street (2 patents)Akshay N SinghChan H Yoo (2 patents)Akshay N SinghYi Xu (2 patents)Akshay N SinghSteven R Eskildsen (2 patents)Akshay N SinghLiana Foster (2 patents)Akshay N SinghKunal R Parekh (1 patent)Akshay N SinghEiichi Nakano (1 patent)Akshay N SinghKeizo Kawakita (1 patent)Akshay N SinghDebjit Datta (1 patent)Akshay N SinghAkshay N Singh (16 patents)Kyle K KirbyKyle K Kirby (210 patents)Owen R FayOwen R Fay (107 patents)Hong Wan NgHong Wan Ng (60 patents)Bharat BhushanBharat Bhushan (7 patents)Bret K StreetBret K Street (85 patents)Chan H YooChan H Yoo (65 patents)Yi XuYi Xu (26 patents)Steven R EskildsenSteven R Eskildsen (25 patents)Liana FosterLiana Foster (3 patents)Kunal R ParekhKunal R Parekh (287 patents)Eiichi NakanoEiichi Nakano (35 patents)Keizo KawakitaKeizo Kawakita (26 patents)Debjit DattaDebjit Datta (1 patent)
..
Inventor’s number of patents
..
Strength of working relationships

Company Filing History:

1. Micron Technology Incorporated (16 from 37,905 patents)


16 patents:

1. 12424590 - Semiconductor device assemblies and associated methods

2. 12278202 - Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods

3. 12255163 - Bond pads for semiconductor die assemblies and associated methods and systems

4. 12191162 - Semiconductor device assembly with pillar array

5. 11973062 - High density pillar interconnect conversion with stack to substrate connection

6. 11631644 - High density pillar interconnect conversion with stack to substrate connection

7. 11587912 - High density pillar interconnect conversion with stack to substrate connection

8. 11094670 - Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

9. 11088114 - High density pillar interconnect conversion with stack to substrate connection

10. 10998271 - High density pillar interconnect conversion with stack to substrate connection

11. 10943794 - Semiconductor device assembly with pillar array and test ability

12. 10529592 - Semiconductor device assembly with pillar array

13. 10522507 - Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

14. 10366934 - Face down dual sided chip scale memory package

15. 10312219 - Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

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as of
12/7/2025
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