The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 18, 2023
Filed:
Apr. 02, 2021
Micron Technology, Inc., Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor device assembly can include a semiconductor device having a substrate and vias electrically connected to circuitry of the semiconductor device. Individual vias can have an embedded portion extending from the first side to the second side of the substrate and an exposed portion projecting from the second side of the substrate. The assembly can include a density-conversion connector comprising a connector substrate and a first array of contacts formed at the first side thereof, the first array of contacts occupying a first footprint area on the first side thereof, and wherein individual contacts of the first array are electrically connected to the exposed portion of a corresponding via of the semiconductor device. The assembly can include a second array of contacts electrically connected to the first array, formed at the second side of the connector substrate, and occupying a second footprint area larger than the first footprint area.