Akira Mao

Title: Innovator Spotlight: Akira Mao and His Contributions to Semiconductor Technologies

Introduction: Akira Mao, an inventive mind based in Tainan, Taiwan, has made notable strides in the realm of semiconductor technology. With a total of two patents to his name, his innovative methods have significantly advanced the fabrication techniques used in semiconductor devices.

Latest Patents: Akira Mao holds two patents that reveal his expertise in semiconductor fabrication. The first patent describes a fabrication method for a dual damascene structure. This method involves providing a substrate with a first conductive layer, forming a silicon nitride first dielectric layer, and patterning it to create a trench-like structure. The method continues with the formation of a silicon oxide second dielectric layer within the trench, where an air-gap is concurrently created. Following this, the second dielectric layer is planarized until the surface of the first dielectric layer is exposed, allowing for the removal of the first dielectric layer to create a trench filled with a second conductive layer.

His second patent lays out a method of fabricating a semiconductor device. This process begins with the formation of a conductive layer on a substrate, followed by a spacer on the sidewall of that layer. A thin metallic layer is then placed over the substrate, and an ion implantation step is performed. The process concludes with the formation of seeding layers, an additional metallic layer, and an annealing step to create a self-aligned silicide layer on the conductive layer.

Career Highlights: Throughout his career, Akira Mao has worked with significant organizations within the semiconductor industry. He has gained valuable experience at United Microelectronics Corporation and United Semiconductor Corporation, where he honed his skills and contributed to various advancements in semiconductor technology.

Collaborations: Collaboration has been a key element of Akira Mao's career. He has worked alongside notable coworkers such as Min-Hung Wang and Ming-Shing Chen, showcasing the importance of teamwork in the innovative processes of semiconductor development.

Conclusion: Akira Mao's contributions to semiconductor fabrication methodologies exemplify the cutting-edge innovations driving the industry forward. With his patents, he has established himself as a formidable inventor, highlighting the continuous evolution of technology in the field. As Akira Mao advances in his career, the impact of his work will likely resonate within the semiconductor industry for years to come.