logo

For the Inventor, By the Inventor

Kiyotake, Japan

Akihiro Ishii

This inventor holds 5 USPTO granted patents. Top assignee: Komatsu Electronic Metals Co., Ltd.. Active years: 1999-2001.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Akihiro Ishii. Retrieved from https://idiyas.com/inventor/akihiro-ishii-cbdg5zau

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 5

% Patents Active = 100.0

Average Co-Inventor Count = 2.7

ph-index = 5

Forward Citations = 53(Granted Patents)


Location History:

  • Miyazaki-gun, JP (1999)
  • Kobayashi, JP (1999)
  • Miyazaki, JP (2000 - 2001)
  • Kiyotake-cho, JP (2001)

Company Filing History:

goldMedal5 out of 142 
 
Komatsu Electronic Metals Co., Ltd.
 patents

Years Active: 1999-2001

Loading Chart...
5 patents (USPTO):Explore Patents
1. 6245678 - Method for manufacturing semiconductor wafers (2001-06-12),
2. 6234873 - Semiconductor mirror-polished surface wafers and method for manufacturing the same (2001-05-22),
3. 6090688 - Method for fabricating an SOI substrate (2000-07-18),
4. 6004860 - SOI substrate and a method for fabricating the same (1999-12-21),
5. 5863829 - Process for fabricating SOI substrate (1999-01-26),

Title: Akihiro Ishii: Innovator in Semiconductor Manufacturing

Introduction

Akihiro Ishii is a prominent inventor based in Kiyotake-cho, Japan. He has made significant contributions to the field of semiconductor manufacturing, holding a total of 5 patents. His innovative approaches have led to advancements in the efficiency and quality of semiconductor wafer production.

Latest Patents

Ishii's latest patents include a method for manufacturing semiconductor wafers utilizing a Bernoulli type chucking device. This device supports the rear surface of a semiconductor wafer, allowing the etchant to effectively reach the beveled portion of the wafer while being restrained by a gas flow. This innovative method ensures that the beveled portion is mirror-finished during the etching process, enhancing the overall efficiency compared to conventional methods. Another notable patent is for a method of manufacturing semiconductor wafers that involves slicing a single-crystal semiconductor ingot, beveling the wafers, and controlling the glossiness of the rear surfaces to achieve mirror-polished finishes.

Career Highlights

Akihiro Ishii works at Komatsu Electronic Metals Co., Ltd., where he has been instrumental in developing advanced semiconductor manufacturing techniques. His work has not only improved production processes but has also contributed to the overall quality of semiconductor products in the industry.

Collaborations

Ishii collaborates with talented coworkers such as Yuichi Nakayoshi and Hiroaki Yamamoto. Their combined expertise fosters an environment of innovation and creativity, leading to groundbreaking advancements in semiconductor technology.

Conclusion

Akihiro Ishii's contributions to semiconductor manufacturing exemplify the impact of innovative thinking in technology. His patents and collaborative efforts continue to shape the future of the semiconductor industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
Loading…