The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2001
Filed:
Jan. 07, 1999
Hiroaki Yamamoto, Kiyotake-cho, JP;
Akihiro Ishii, Kiyotake-cho, JP;
Komatsu Electronic Metals Co., Ltd., Hiratsuku, JP;
Abstract
A Bernoulli type chucking device,supports the rear surface,of a semiconductor wafer,The etchant,turns around and reaches the portion beneath the beveled portion,of the semiconductor wafers,However, the etchant is restrained on the beveled portion by a gas flow coming from the openings,A of the gas-expelling passages,in the centrifugal direction. The gas belows off the etchant, which has turned around and is going to reach the rear surface. Thus, the beveled portion,is mirror-finished when etching of the semiconductor wafer front surface,is carried out, and mirror-finishing of part of the rear surface,can be avoided. Furthermore, mirror-finishing can be performed without being influenced by the shape of the beveled portions of semiconductor wafers. Compared with conventional method, this invention can perform mirror-finishing more efficiently.