This inventor holds 3 USPTO granted patents. Top assignee: Kabushiki Kaisha Shinkawa. Active years: 1990-1993.
Location History:
- Tachikawa, JP (1990)
- Tokyo, JP (1993)
Company Filing History:
Years Active: 1990-1993
Title: Akihiro Hirayanagi: Innovator in Semiconductor Bonding Technology
Introduction
Akihiro Hirayanagi is a prominent inventor based in Tokyo, Japan. He has made significant contributions to the field of semiconductor bonding technology. With a total of 3 patents to his name, Hirayanagi continues to push the boundaries of innovation in this critical area of electronics.
Latest Patents
Hirayanagi's latest patents include a wire bonding apparatus and a wire bonding method and apparatus. The wire bonding apparatus features a linear sensor mounted on a bonding head frame. This design allows for precise detection of the gap between the arm holder and the bonding head frame, ensuring accurate bonding surface level determination. The wire bonding method and apparatus utilize a linear sensor to detect vertical movement of a bonding arm holder. This innovation allows for reliable contact detection with the bonding surface, minimizing the impact of vibrations that can affect bonding processes.
Career Highlights
Hirayanagi is currently employed at Kabushiki Kaisha Shinkawa, a company known for its advancements in semiconductor manufacturing equipment. His work has been instrumental in enhancing the efficiency and reliability of bonding processes in semiconductor devices.
Collaborations
Hirayanagi collaborates with talented individuals in his field, including Tooru Mochida and Yoshimitsu Terakado. Their combined expertise contributes to the innovative solutions developed at Kabushiki Kaisha Shinkawa.
Conclusion
Akihiro Hirayanagi's contributions to semiconductor bonding technology exemplify the spirit of innovation. His patents reflect a commitment to improving the efficiency and reliability of bonding processes in the electronics industry.