The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 15, 1993
Filed:
May. 07, 1992
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
228-45 ; 228-8 ;
Abstract
In a bonding apparatus for semiconductor devices, etc., a linear sensor is mounted on a bonding head frame. An arm holder which has a bonding capillary at one end is pivotally mounted to the bonding head frame, and the linear sensor is positioned so that it faces a middle portion of the arm holder which locates an opposite side of pivotal point of the arm holder from the capillary. The linear sensor detects the gap between the arm holder and the bonding head frame when the arm holder pivots, thus determining the bonding surface level of a workpiece by the capillary which comes into contact with the workpiece.