Kabushiki Kaisha Shinkawa

Akihiro Hirayanagi

Yoshimitsu Terakado

Tooru Mochida

Nobuto Yamazaki

Shigeru Fuke

In a bonding apparatus for semiconductor devices, etc., a linear sensor is mounted on a bonding head frame. An arm holder which has a bonding capillary at one end is pivotally mounted to the bonding head frame, and the linear sensor is positioned so that it faces a middle portion of the arm holder which locates an opposite side of pivotal point of the arm holder from the capillary. The linear sensor detects the gap between the arm holder and the bonding head frame when the arm holder pivots, thus determining the bonding surface level of a workpiece by the capillary which comes into contact with the workpiece.

Wire bonding apparatus

In a bonding method and apparatus, a vertical movement of a bonding arm holder that has a capillary at the tip end is detected by a linear sensor and data based upon such a detection is outputted by the sensor. The output date in a predetermined range is checked if it is within a permissible range. If the output data is within the permissible range, it is determined that the capillary has come into contact with a bonding surface, and such a determination can be made without being affected by noises that often occur in bonding apparatus caused by vibrations.

Wire bonding method and apparatus

A dispenser apparatus for dropping paste onto a substrates, etc. including a syringe having a nozzle, a motor which moves the syringe up and down, a controller which controls the rotational stopping positions and rotational speed of the motor, and digital switches for inputting a setting program into the controller. The setting program sets the rotational stopping positions and rotational speed of the motor so that the position at which lowering of the nozzle stops and the speed at which the nozzle is raised are controlled through the setting program.

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Tokyo, Japan

Akihiro Hirayanagi