Ahmad B Hamzehdoost

Title: The Innovations of Ahmad B. Hamzehdoost

Introduction

Ahmad B. Hamzehdoost is a notable inventor based in Sacramento, California, recognized for his contributions to the field of integrated circuit packaging. With an impressive portfolio of 13 patents, Hamzehdoost has made significant advancements in methods and techniques that improve the reliability and functionality of electronic components.

Latest Patents

One of his latest innovations is the "Method of fabricating a BGA package using PCB and tape in a die-up configuration." This patent describes a die-up configuration that integrates a rigid circuit board with electrically conductive plated-through holes. An integrated-circuit die is affixed to the upper surface, complemented by a flexible insulated tape layer that includes several wire-bonding sites. This design allows for efficient connectivity through conductive vias or plated-through holes connecting the flexible tape's wire-bonding sites to contact areas located beneath it, ultimately linking to solder balls on the rigid circuit board.

Another notable patent is the "Reinforced sealing technique for an integrated circuit package." This innovation involves the insertion of reinforcement pins between the lid and base of a sealed integrated-circuit package. These pins enhance the sealing layer's strength, particularly against shear forces. The invention incorporates shorter pins that do not penetrate through the lid or base, alongside longer pins that extend fully through them. The ends of these longer pins are secured and sealed with solder, glass, or epoxy material, ensuring the durability of the package.

Career Highlights

Throughout his career, Ahmad B. Hamzehdoost has worked with distinguished companies, including VLSI Technology, Inc., where he contributed to pioneering developments in semiconductor technology. His practical experience and technical expertise have been crucial in pushing the boundaries of electronics manufacturing.

Collaborations

During his tenure at various organizations, Hamzehdoost has collaborated with notable professionals, including Leonard Lucio Mora and Chin-Ching Huang. These partnerships have enriched his projects, allowing for diverse insights and shared knowledge in pursuit of innovative solutions.

Conclusion

Ahmad B. Hamzehdoost's contributions to the field of electronics through his innovative patents and collaborations have marked him as a prominent figure in the industry. His work continues to influence the development of more efficient and reliable electronic packaging solutions, paving the way for future advancements in technology.