The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 08, 1999
Filed:
Jul. 23, 1998
Ahmad Hamzehdoost, Sacramento, CA (US);
Robert J Martin, Salida, CA (US);
VLSI Technology, Inc., San Jose, CA (US);
Abstract
An integrated-circuit die is attached to the top interior surface of a die-cavity formed in the underside of a heat spreader. The other side of the integrated circuit die has a number of wire-bonding pads formed thereupon. A plurality of bonding-wire loops at least some of which are completely contained within the die-cavity to allow the part of the encapsulation or lid to be as thin as possible, while still covering the bonding wires. A first portion of a insulated tape layer covers the lower outside surface of the die-carrier/heat spreader and another portion of the insulated tape layer extends inside of the die-cavity and has a number of wire-bonding sites formed thereupon. A plurality of bonding-wire loops are bonded to one of the wire-bonding pads formed on the integrated-circuit die and the wire-bonding sites formed on the insulated tape layer. Conductive traces connect the wire-bonding sites located inside of the die-cavity to respective selective solderable areas arranged in a grid pattern for receipt of solder balls. Encapsulation material or a ceramic or metal lid cover and seal the integrated-circuit die and the bonding wires in the die-cavity. The wire-bonding sites formed in the die-cavity are adhesively fixed to the top interior surface of the die-cavity. To increase bonding-wire density, the wire-bonding sites and the wire-bonding pads on the integrated-circuit die are arranged in two or more rows. Other wire-bonding sites are optionally formed outside of the die-cavity.