The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 04, 1995
Filed:
Jun. 23, 1993
Applicant:
Inventors:
Ahmad Hamzehdoost, Sacramento, CA (US);
Sang S Lee, Sunnyvale, CA (US);
Assignee:
VLSI Technology, Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; H01L / ;
U.S. Cl.
CPC ...
257796 ; 257712 ; 257722 ; 257787 ; 257670 ; 257675 ; 257666 ;
Abstract
An integrated-circuit die attached to a thermally conductive substrate having surface variations formed into the surface of the thermally conductive substrate. A lead frame has inwardly-extending fingers, which are attached to the thermally conductive substrate. The integrated circuit die, lead frame, and substrate are enclosed within a mold cavity. The surface variations of the thermally conductive substrate provide for a more balanced flow of plastic material over the top and bottom of the substrate provide a molded package body substantially free of voids.