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Curacao, Netherlands Antilles

Unitive International Limited

USPTO Granted Patents = 22

Forward Citations = 295

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17 inventors (with patents filed for the assignee):

Glenn A Rinne (18 out of 71 patents)

William E Batchelor (5 out of 8 patents)

J Daniel Mis (5 out of 9 patents)

4. Krishna K Nair (5 out of 6 patents)

5. Dean Zehnder (2 out of 8 patents)

6. Gretchen Adema (2 out of 4 patents)

7. Susan Bumgarner (2 out of 2 patents)

8. Pooja Chilukuri (2 out of 2 patents)

9. Christine Rinne (2 out of 2 patents)

10. Joseph Daniel Mis (2 out of 6 patents)

11. Paul A Magill (2 out of 5 patents)

12. J Daniels Mis (2 out of 2 patents)

13. Kevin Engel (1 out of 2 patents)

14. Jong-Rong Jan (1 out of 2 patents)

15. Tsai-Hua Lu (1 out of 2 patents)

22 patents: Sort by Forward Citations

1. 8294269 - Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers (2012-10-23),

2. 7879715 - Methods of forming electronic structures including conductive shunt layers and related structures (2011-02-01),

3. 7839000 - Solder structures including barrier layers with nickel and/or copper (2010-11-23),

4. 7834454 - Electronic structures including barrier layers defining lips (2010-11-16),

5. 7665652 - Electronic devices including metallurgy structures for wire and solder bonding (2010-02-23),

6. 7659621 - Solder structures for out of plane connections (2010-02-09),

7. 7579694 - Electronic devices including offset conductive bumps (2009-08-25),

8. 7550849 - Conductive structures including titanium-tungsten base layers (2009-06-23),

9. 7547623 - Methods of forming lead free solder bumps (2009-06-16),

10. 7531898 - Non-Circular via holes for bumping pads and related structures (2009-05-12),

11. 7495326 - Stacked electronic structures including offset substrates (2009-02-24),

12. 7427557 - Methods of forming bumps using barrier layers as etch masks (2008-09-23),

13. 7297631 - Methods of forming electronic structures including conductive shunt layers and related structures (2007-11-20),

14. 7244671 - Methods of forming conductive structures including titanium-tungsten base layers and related structures (2007-07-17),

15. 7213740 - Optical structures including liquid bumps and related methods (2007-05-08),

Unitive International Limited is a global company specializing in providing innovative software solutions for businesses. With a team of experienced professionals, Unitive International is committed to delivering high-quality products and services that help businesses streamline their operations and enhance productivity. Visit our website to learn more about our range of software solutions and how we can help your business grow.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Jan 6 2026

22 Patents

#3 in Curacao

#319 in Netherlands Antilles

#27,919 in the World

Curacao, Netherlands Antilles

Unitive International Limited

Forward Citations = 295

17 inventors:

Glenn A Rinne (18 out of 71 patents)

William E Batchelor (5 out of 8 patents)

J Daniel Mis (5 out of 9 patents)

4. Krishna K Nair (5 out of 6 patents)

5. Dean Zehnder (2 out of 8 patents)

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