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Curacao, Netherlands Antilles

Unitive International Limited

USPTO Granted Patents = 22

% Expired Patents = 18.2

Forward Citations = 296

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17 inventors (with patents filed for the assignee):

Glenn A Rinne (18 out of 71 patents)

William E Batchelor (5 out of 8 patents)

J Daniel Mis (5 out of 9 patents)

4. Krishna K Nair (5 out of 6 patents)

5. Dean Zehnder (2 out of 8 patents)

6. Gretchen Adema (2 out of 4 patents)

7. Susan Bumgarner (2 out of 2 patents)

8. Pooja Chilukuri (2 out of 2 patents)

9. Christine Rinne (2 out of 2 patents)

10. Joseph Daniel Mis (2 out of 6 patents)

11. Paul A Magill (2 out of 5 patents)

12. J Daniels Mis (2 out of 2 patents)

13. Kevin Engel (1 out of 2 patents)

14. Jong-Rong Jan (1 out of 2 patents)

15. Tsai-Hua Lu (1 out of 2 patents)

22 patents: Sort by Forward Citations

1. 8294269 - Electronic structures including conductive layers comprising copper and having a thickness of at least 0.5 micrometers (2012-10-23),

2. 7879715 - Methods of forming electronic structures including conductive shunt layers and related structures (2011-02-01),

3. 7839000 - Solder structures including barrier layers with nickel and/or copper (2010-11-23),

4. 7834454 - Electronic structures including barrier layers defining lips (2010-11-16),

5. 7665652 - Electronic devices including metallurgy structures for wire and solder bonding (2010-02-23),

6. 7659621 - Solder structures for out of plane connections (2010-02-09),

7. 7579694 - Electronic devices including offset conductive bumps (2009-08-25),

8. 7550849 - Conductive structures including titanium-tungsten base layers (2009-06-23),

9. 7547623 - Methods of forming lead free solder bumps (2009-06-16),

10. 7531898 - Non-Circular via holes for bumping pads and related structures (2009-05-12),

11. 7495326 - Stacked electronic structures including offset substrates (2009-02-24),

12. 7427557 - Methods of forming bumps using barrier layers as etch masks (2008-09-23),

13. 7297631 - Methods of forming electronic structures including conductive shunt layers and related structures (2007-11-20),

14. 7244671 - Methods of forming conductive structures including titanium-tungsten base layers and related structures (2007-07-17),

15. 7213740 - Optical structures including liquid bumps and related methods (2007-05-08),

Company Overview

Unitive International Limited is a company based in Curacao, specializing in innovative solutions across various sectors. The organization focuses on developing advanced technologies and products that enhance operational efficiency and drive growth. With a commitment to research and development, Unitive International engages in diverse fields, including software solutions and engineering services, aiming to deliver high-quality offerings that meet the evolving needs of its clients in the global market.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 6 2026

22 Patents

#9 in Curacao

#325 in Netherlands Antilles

#28,749 in the World

Curacao, Netherlands Antilles

Unitive International Limited

Forward Citations = 296

17 inventors:

Glenn A Rinne (18 out of 71 patents)

William E Batchelor (5 out of 8 patents)

J Daniel Mis (5 out of 9 patents)

4. Krishna K Nair (5 out of 6 patents)

5. Dean Zehnder (2 out of 8 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Unitive International Limited. Retrieved from https://idiyas.com/company/unitive-international

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

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