Tsai-Hua Lu

Title: The Innovations of Tsai-Hua Lu

Introduction

Tsai-Hua Lu is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic devices, particularly in the area of integrated circuit substrates. With a total of two patents to his name, Lu's work has had a considerable impact on the industry.

Latest Patents

Tsai-Hua Lu's latest patents include innovative methods for bumping substrates with metal layers. One of his patents focuses on electronic devices that involve forming a barrier layer on a substrate with a metal layer. This process includes creating a conductive bump on the barrier layer, which is laterally offset from the metal layer. After the conductive bump is formed, the barrier layer can be removed to expose the metal layer while maintaining a portion of the barrier layer between the conductive bump and the substrate. Related structures are also discussed in this patent. Another patent by Lu elaborates on methods of selectively bumping integrated circuit substrates, detailing similar processes and structures.

Career Highlights

Throughout his career, Tsai-Hua Lu has worked with several companies, including Unitive Electronics Inc. and Unitive International Limited. His experience in these organizations has allowed him to refine his skills and contribute to advancements in electronic device technology.

Collaborations

Some of Tsai-Hua Lu's notable coworkers include Jong-Rong Jan and Sao-Ling Chiu. Their collaboration has likely fostered an environment of innovation and creativity in their respective projects.

Conclusion

Tsai-Hua Lu's contributions to the field of electronic devices and integrated circuits demonstrate his expertise and innovative spirit. His patents reflect a commitment to advancing technology and improving electronic device functionality.