The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 25, 2006
Filed:
Feb. 17, 2004
Jong-rong Jan, Hualian Hsien, TW;
Tsai-hua LU, Hisn-Chu, TW;
Sao-ling Chiu, Hisn-Chu, TW;
Ling-chen Kung, Hisn-Chu, TW;
Jong-Rong Jan, Hualian Hsien, TW;
Tsai-Hua Lu, Hisn-Chu, TW;
Sao-Ling Chiu, Hisn-Chu, TW;
Ling-Chen Kung, Hisn-Chu, TW;
Unitive Electronics Inc., Morrisville, NC (US);
Abstract
Bumping a substrate having a metal layer thereon may include forming a barrier layer on the substrate including the metal layer and forming a conductive bump on the barrier layer. Moreover, the barrier layer may be between the conductive bump and the substrate, and the conductive bump may be laterally offset from the metal layer. After forming the conductive bump, the barrier layer may be removed from the metal layer thereby exposing the metal layer while maintaining a portion of the barrier layer between the conductive bump and the substrate. Related structures are also discussed.