Ling-Chen Kung

Title: Ling-Chen Kung: Innovator in Electronic Devices

Introduction

Ling-Chen Kung is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of electronic devices, holding a total of 2 patents. His work focuses on innovative methods for enhancing the functionality and efficiency of integrated circuits.

Latest Patents

Kung's latest patents include groundbreaking technologies related to electronic devices. One of his patents discusses the process of bumping a substrate that has a metal layer. This process involves forming a barrier layer on the substrate and creating a conductive bump on this barrier layer. The barrier layer serves as a crucial component, positioned between the conductive bump and the substrate. After the conductive bump is formed, the barrier layer can be removed from the metal layer, exposing it while still maintaining a portion of the barrier layer between the conductive bump and the substrate. Related structures are also elaborated upon in this patent. Another patent by Kung outlines methods of selectively bumping integrated circuit substrates, detailing similar processes and structures.

Career Highlights

Throughout his career, Ling-Chen Kung has worked with several prominent companies in the electronics industry. He has been associated with Unitive Electronics Inc. and Unitive International Limited, where he has contributed to various innovative projects and developments.

Collaborations

Kung has collaborated with notable colleagues in his field, including Jong-Rong Jan and Tsai-Hua Lu. Their combined expertise has likely contributed to the advancements in the technologies they have worked on together.

Conclusion

Ling-Chen Kung's contributions to electronic devices and integrated circuits highlight his innovative spirit and dedication to advancing technology. His patents reflect a deep understanding of the complexities involved in electronic design and manufacturing.