Company Filing History:
Years Active: 2006-2009
Title: Jong-Rong Jan: Innovator in Electronic Device Technology
Introduction
Jong-Rong Jan is a notable inventor based in Hua-Lian Hsien, Taiwan. He has made significant contributions to the field of electronic devices, holding two patents that showcase his innovative approach to technology. His work primarily focuses on methods of bumping integrated circuit substrates, which are crucial for modern electronic applications.
Latest Patents
Jong-Rong Jan's latest patents include advancements in electronic devices featuring offset conductive bumps. This patent describes a process where a substrate with a metal layer is treated to form a barrier layer, followed by the creation of a conductive bump on this barrier. The design allows for the conductive bump to be laterally offset from the metal layer, enhancing the functionality of the device. Additionally, the barrier layer can be removed after the bump formation, exposing the metal layer while retaining a portion of the barrier between the bump and the substrate. Related structures are also discussed in this patent. Another patent focuses on methods of selectively bumping integrated circuit substrates, detailing similar processes and structures that improve electronic device performance.
Career Highlights
Throughout his career, Jong-Rong Jan has worked with prominent companies in the electronics sector, including Unitive Electronics Inc. and Unitive International Limited. His experience in these organizations has allowed him to refine his skills and contribute to significant technological advancements.
Collaborations
Jong-Rong Jan has collaborated with talented individuals in his field, including Tsai-Hua Lu and Sao-Ling Chiu. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Jong-Rong Jan is a distinguished inventor whose work in electronic devices has led to valuable patents that enhance the functionality of integrated circuits. His contributions to the field reflect a commitment to innovation and technological advancement.