The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 23, 2010
Filed:
May. 08, 2009
J. Daniel Mis, Cary, NC (US);
Gretchen Adema, Raleigh, NC (US);
Susan Bumgarner, Clearwater, FL (US);
Pooja Chilukuri, Morrisville, NC (US);
Christine Rinne, Apex, NC (US);
Glenn Rinne, Apex, NC (US);
J. Daniel Mis, Cary, NC (US);
Gretchen Adema, Raleigh, NC (US);
Susan Bumgarner, Clearwater, FL (US);
Pooja Chilukuri, Morrisville, NC (US);
Christine Rinne, Apex, NC (US);
Glenn Rinne, Apex, NC (US);
Unitive International Limited, Curacao, AN;
Abstract
An electronic device may include an electronic substrate, and an under bump seed metallurgy layer on the electronic substrate. A barrier layer may be provided on the under bump seed metallurgy layer so that the under bump seed metallurgy layer is between the barrier layer and the electronic substrate, and the barrier layer may include nickel and/or copper. Moreover, portions of the under bump seed metallurgy layer may be undercut relative to portions of the barrier layer. In addition, a solder layer may be provided on the barrier layer so that the barrier layer is between the solder layer and the under bump seed metallurgy layer.