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Forward Citations = 56

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8 inventors (with patents filed for the assignee):

Jacques J Weinstock (4 out of 5 patents)

Derek Lieber (4 out of 5 patents)

William D Hay (3 out of 4 patents)

4. Julius Schlesinger (2 out of 2 patents)

5. Alfred J Baker (1 out of 5 patents)

6. Raymond James Prohaska (1 out of 1 patent)

7. Sidney Lieber (1 out of 2 patents)

8. James Saunders (1 out of 1 patent)

7 patents: Sort by Forward Citations

1. 4229652 - Backscatter apparatus and method for measuring thickness of a (1980-10-21),

2. 4190770 - Backscatter instrument having indexing feature for measuring coating (1980-02-26),

3. 4155009 - Thickness measurement instrument with memory storage of multiple (1979-05-15),

4. 4115690 - Backscatter instrument for measuring thickness of a continuously moving (1978-09-19),

5. 4079237 - Card controlled beta backscatter thickness measuring instrument (1978-03-14),

6. 4046994 - Control card receiving and sensing assembly (1977-09-06),

7. 4042880 - Electrode assembly for measuring the effective thickness of thru-hole (1977-08-16),

Unit Process Assemblies, Inc. specializes in providing high-quality process assemblies for various industries. With expertise in engineering, design, and manufacturing, we offer custom solutions to meet our clients' unique requirements. Our team is committed to delivering reliable, efficient, and cost-effective products to enhance production processes.

Profile summary based on public USPTO records.