Trademarks = 5

Forward Citations = 0

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5 inventors (with patents filed for the assignee):

Wen Feng Lee (1 out of 9 patents)

Feng-Chun Yu (1 out of 3 patents)

Ru-Yi Cai (1 out of 2 patents)

4. Kai-Wei Lo (1 out of 1 patent)

5. Kuo-Chang Lo (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 12404438 - Thermally conductive board (2025-09-02),

2. 12023893 - Insulated metal substrate and method for manufacturing same (2024-07-02),

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USPTO Data Jan 1 1976 - Oct 20 2026

2 Patents

#50 in Miaoli

#4,255 in Taiwan

Miaoli, Taiwan

Tclad Technology Corporation

Forward Citations = 0

5 inventors:

Wen Feng Lee (1 out of 9 patents)

Feng-Chun Yu (1 out of 3 patents)

Ru-Yi Cai (1 out of 2 patents)

4. Kai-Wei Lo (1 out of 1 patent)

5. Kuo-Chang Lo (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Tclad Technology Corporation. Retrieved from https://idiyas.com/company/tclad-technology

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]