Linluo, Taiwan

Ru-Yi Cai

This inventor holds 2 USPTO granted patents and 1 published patent application. Top assignees: Polytronics Technology Corporation, Tclad Technology Corporation. Active years: 2022-2024.

USPTO Granted Patents = 2 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2022-2024

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2 patents (USPTO):Explore Patents

Title: The Innovative Contributions of Ru-Yi Cai

Introduction

Ru-Yi Cai is a notable inventor based in Linluo, Taiwan. He has made significant contributions to the field of insulated metal substrates, holding a total of 2 patents. His work focuses on enhancing the efficiency and reliability of electronic components through innovative manufacturing methods.

Latest Patents

One of Ru-Yi Cai's latest patents is for an insulated metal substrate (IMS) and the method for manufacturing it. This invention includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer effectively fills the gaps between multiple electrically conductive lines of the line pattern layer. Notably, the upper surface of the encapsulation layer is flush with the upper surface of the conductive line pattern layer. The first and second adhesive layers are strategically placed between the conductive line pattern layer and the heat sink element, ensuring a bonding strength greater than 80 kg/cm.

Career Highlights

Throughout his career, Ru-Yi Cai has worked with several prominent companies, including Polytronics Technology Corporation and Tclad Technology Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Ru-Yi Cai has collaborated with notable colleagues such as Wen Feng Lee and Feng-Chun Yu. These partnerships have further enriched his work and expanded the impact of his inventions.

Conclusion

Ru-Yi Cai's contributions to the field of insulated metal substrates demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of electronic manufacturing processes, making him a valuable figure in the industry.

Profile summary based on public USPTO records.
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