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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12023893 B1

PDFFull Text
Date of Patent:
Jul. 02, 2024

Filed:

Oct. 28, 2021

Insulated metal substrate and method for manufacturing same

Applicant:

Polytronics Technology Corp., Hsinchu, TW;

Inventors:

Feng-Chun Yu, Yuanshan Township, Yilan County, TW;

Kai-Wei Lo, Zhubei, TW;

Wen Feng Lee, Taoyuan, TW;

Ru-Yi Cai, Linluo Township, Pingtung County, TW;

Assignee:

TCLAD TECHNOLOGY CORPORATION, Miaoli County, TW;

Attorney:

MUNCY, GEISSLER, OLDS & LOWE, P.C.

Primary Examiner:

Philip C Tucker

Assistant Examiner:

Nickolas R Harm

Int. Cl.
CPC ...
B32B 43/00 (2006.01); B32B 7/12 (2006.01); B32B 15/092 (2006.01); B32B 15/20 (2006.01); B32B 38/10 (2006.01); H01L 21/3105 (2006.01); H01L 21/48 (2006.01); H01L 23/14 (2006.01); H01L 23/373 (2006.01); B29C 65/48 (2006.01); B32B 37/12 (2006.01); B32B 37/24 (2006.01); B32B 38/18 (2006.01);
U.S. Cl.
CPC ...
B32B 15/20 (2013.01); B32B 7/12 (2013.01); B32B 15/092 (2013.01); B32B 38/10 (2013.01); H01L 21/31051 (2013.01); H01L 21/4807 (2013.01); H01L 23/142 (2013.01); H01L 23/3735 (2013.01); B29C 65/48 (2013.01); B32B 2037/1253 (2013.01); B32B 2037/243 (2013.01); B32B 38/1833 (2013.01); B32B 43/006 (2013.01); B32B 2264/102 (2013.01); B32B 2307/102 (2013.01); B32B 2307/302 (2013.01); B32B 2309/02 (2013.01); B32B 2309/105 (2013.01); B32B 2311/00 (2013.01); B32B 2457/04 (2013.01); B32B 2457/08 (2013.01);
Abstract

An insulated metal substrate (IMS) and a method for manufacturing the same are disclosed. The IMS includes an electrically conductive line pattern layer, an encapsulation layer, a first adhesive layer, a second adhesive layer, and a heat sink element. The encapsulation layer fills a gap between a plurality of electrically conductive lines of the electrically conductive line pattern layer. An upper surface of the encapsulation layer is flush with an upper surface of the electrically conductive line pattern layer. The first and second adhesive layer are disposed between the electrically conductive line pattern layer and the heat sink element. A bonding strength between the first adhesive layer and the second adhesive layer is greater than 80 kg/cm.

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