Stats Chippac Semiconductor (Jiangyin) Co., Ltd.

Calculating rank

USPTO Granted Patents = 2

Forward Citations = 0

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5 inventors (with patents filed for the assignee):

Shuai Yang (1 out of 1 patent)

Hongde Dai (1 out of 1 patent)

Jian Xu (1 out of 1 patent)

4. Man Bao (1 out of 2 patents)

5. Weijun Wang (1 out of 1 patent)

2 patents: Sort by Forward Citations

1. 12713930 - CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF (2026-08-18),

2. 12550727 - Elastic heat spreader for chip package, package structure and packaging method (2026-02-10),

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USPTO Data Jan 1 1976 - Oct 27 2026

2 Patents

#76 in Wuxi

#11,649 in China

Wuxi, China

Stats Chippac Semiconductor (Jiangyin) Co., Ltd.

Forward Citations = 0

5 inventors:

Shuai Yang (1 out of 1 patent)

Hongde Dai (1 out of 1 patent)

Jian Xu (1 out of 1 patent)

4. Man Bao (1 out of 2 patents)

5. Weijun Wang (1 out of 1 patent)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Stats Chippac Semiconductor (Jiangyin) Co., Ltd.. Retrieved from https://idiyas.com/company/stats-chippac-semiconductor-jiangyin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]