This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Stats Chippac Semiconductor (Jiangyin) Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Hongde Dai and Semiconductor Packaging Innovation.
Introduction
Hongde Dai is an inventor associated with Wuxi, China, whose patent work focuses on semiconductor packaging and heat management. His listed patent is titled “Chip Package with Heat Dissipation Plate and Manufacturing Method Thereof.”
Latest Patents
Dai is credited with 1 patent: “Chip Package with Heat Dissipation Plate and Manufacturing Method Thereof.” The invention concerns a chip package incorporating a heat-dissipation plate, along with a method for manufacturing the package.
Career Highlights
Dai is associated with Stats Chippac Semiconductor (Jiangyin) Co., Ltd., a company working in semiconductor packaging. His patent reflects work on managing heat in chip packages, an important consideration in semiconductor design and manufacturing.
Collaborations
Shuai Yang and Jian Xu are listed as Dai’s coworkers. Their shared company affiliation provides context for the professional environment connected with his patent work.
Conclusion
Hongde Dai’s recorded invention addresses heat dissipation in semiconductor packaging and links his work to Stats Chippac Semiconductor (Jiangyin) Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile