This inventor holds 1 USPTO granted patent. Top assignee: Stats Chippac Semiconductor (Jiangyin) Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Shuai Yang: Semiconductor Packaging Inventor
Introduction
Shuai Yang is an inventor associated with Wuxi, China. His patent work includes a semiconductor packaging invention focused on heat dissipation.
Latest Patents
Yang is listed as an inventor on one patent: “Chip Package with Heat Dissipation Plate and Manufacturing Method Thereof.” The invention concerns a chip package incorporating a heat dissipation plate and a method for manufacturing that package. 1 patent is attributed to him in the provided information.
Career Highlights
Yang is associated with Stats Chippac Semiconductor (Jiangyin) Co., Ltd. His listed patent reflects work in semiconductor packaging and thermal management.
Collaborations
The provided information lists Hongde Dai and Jian Xu as Yang’s coworkers.
Conclusion
Shuai Yang’s recorded invention addresses heat dissipation in chip packaging, highlighting his contribution to semiconductor packaging technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile