This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Stats Chippac Semiconductor (Jiangyin) Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jian Xu: Semiconductor Packaging and Heat Dissipation
Introduction
Jian Xu is an inventor based in Wuxi, China. His patent work concerns semiconductor packaging, with a focus on incorporating a heat dissipation plate into a chip package.
Latest Patents
The supplied information lists one patent associated with Jian Xu: “CHIP PACKAGE WITH HEAT DISSIPATION PLATE AND MANUFACTURING METHOD THEREOF.” The patent addresses both a chip package design and a method for manufacturing it. The available details do not specify its filing or publication date.
Career Highlights
Xu is associated with Stats Chippac Semiconductor (Jiangyin) Co., Ltd., a company working in semiconductor packaging. His listed patent reflects an interest in managing heat in chip packages, an important consideration in semiconductor device design. The supplied information attributes 1 patent to him.
Collaborations
Shuai Yang and Hongde Dai are identified as Xu’s coworkers. Their names are provided as professional associations, but the available information does not specify their roles in the listed patent.
Conclusion
Jian Xu’s listed invention focuses on a chip package with a heat dissipation plate and its manufacturing method, connecting his patent work with semiconductor packaging at Stats Chippac Semiconductor (Jiangyin) Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile