For the Inventor, By the Inventor

Enter assignee name

Sekisui Kasei Co., Ltd.

USPTO Granted Patents = 11

EPO Patents = 2

Forward Citations = 0

Loading Chart...

Loading Chart...

15 inventors (with patents filed for the assignee):

Koichiro Okamoto (3 out of 5 patents)

Kohei Tanaka (2 out of 20 patents)

Kohei Mitani (2 out of 2 patents)

4. Haruhiko Matsuura (2 out of 4 patents)

5. Yusuke Kuwabara (2 out of 2 patents)

6. Kohei Yamada (1 out of 2 patents)

7. Shinya Matsuno (1 out of 2 patents)

8. Tomoyuki Takahashi (1 out of 1 patent)

9. Kohei Tazumi (1 out of 2 patents)

10. Tetsuro Tai (1 out of 1 patent)

11. Ryosuke Harada (1 out of 1 patent)

12. Ryo Akuta (2 patents)

13. Ayano Mori (2 patents)

14. Eiji Fukuyama (0 patent)

15. Shota Endo (0 patent)

11 patents: Sort by Forward Citations

1. 12767811 - Fine resin particle and fine resin particle-containing composition (2026-10-20),

2. 12753256 - Fine resin particle, coating film-softening agent, matting agent for paints, stress reliever for curable resins, light diffuser, light diffusing resin composition, and resin composition (2026-10-06),

3. 12742030 - Fine resin particle and application thereof (2026-09-22),

4. 12703776 - Foamed particles of aromatic polyester resin, production method therefor, molded foam, and member for vehicle (2026-08-11),

5. 12687777 - Resin composition for solder resist, solder resist film, and circuit board (2026-07-21),

6. 12674009 - Hollow resin particles used in resin composition for semiconductor member (2026-07-07),

7. 12674008 - Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles (2026-07-07),

8. 12590208 - Thermoplastic resin foam, thermoplastic resin foam sheet, fiber-reinforced resin composite, method for manufacturing thermoplastic resin foam, thermoplastic resin foam molded article, method for manufacturing thermoplastic resin foam molded article, and foamed resin composite (2026-03-31),

9. 12588548 - Resin composition for semiconductor sealing, underfill material, mold resin, and semiconductor package (2026-03-24),

10. 12545754 - Polymer particles, thickener, and composition (2026-02-10),

11. 12534600 - Hollow resin particle and method for producing same (2026-01-27),

Company Overview

Sekisui Kasei Co., Ltd. is a prominent Japanese company headquartered in Osaka, specializing in the development and manufacturing of advanced materials and chemical products. The organization focuses on innovative solutions in various sectors, including automotive, electronics, and healthcare. With a commitment to sustainability and technological advancement, Sekisui Kasei leverages its expertise in polymer chemistry and material science to create high-performance products that meet the evolving needs of global markets.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 20 2026

11 Patents

#450 in Osaka

#4,139 in Japan

#51,801 in the World

Sekisui Kasei Co., Ltd.

Forward Citations = 0

15 inventors:

Koichiro Okamoto (3 out of 5 patents)

Kohei Tanaka (2 out of 20 patents)

Kohei Mitani (2 out of 2 patents)

4. Haruhiko Matsuura (2 out of 4 patents)

5. Yusuke Kuwabara (2 out of 2 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Sekisui Kasei Co., Ltd.. Retrieved from https://idiyas.com/company/sekisui-kasei

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…