The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 21, 2026
Filed:
Dec. 17, 2020
Applicant:
Sekisui Kasei Co., Ltd., Osaka, JP;
Inventor:
Koichiro Okamoto, Osaka, JP;
Assignee:
SEKISUI KASEI CO., LTD., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/004 (2006.01); H05K 3/28 (2006.01);
U.S. Cl.
CPC ...
G03F 7/004 (2013.01); H05K 3/287 (2013.01);
Abstract
There are provided a resin composition for a solder resist, a solder resist film, and a circuit board that exhibit an excellent low dielectric property by a non-conventional new approach. A resin composition for a solder resist according to an embodiment of the present invention contains a thermosetting resin, an inorganic filler, and hollow resin particles, in which the hollow resin particles are contained in the resin composition for a solder resist in an amount of 1% by weight to 50% by weight.
Okamoto, Koichiro. (2026). Resin composition for solder resist, solder resist film, and circuit board (U.S. Patent No. 12687777). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12687777
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile