This inventor holds 1 USPTO granted patent. Top assignee: Sekisui Kasei Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Ryosuke Harada and Low-Dielectric Hollow Resin Particles
Introduction
Ryosuke Harada is an inventor associated with Sekisui Kasei Co., Ltd. in Osaka, Japan. His listed patent work concerns hollow resin particles designed for resin compositions used in semiconductor members.
Latest Patents
Harada is credited with 1 patent: “Hollow Resin Particles Used in Resin Composition for Semiconductor Member.” The invention describes hollow resin particles containing an internal cavity. In a specified test formulation, a film made with 80 parts by weight of polyimide and 20 parts by weight of the particles has a relative dielectric constant at least 3% lower than a film made with polyimide alone. The particles are intended to help semiconductor members achieve low dielectric properties.
Career Highlights
The available information identifies Harada’s work with Sekisui Kasei Co., Ltd. and highlights his contribution to materials for semiconductor applications. The patent focuses on using hollow particles to reduce the dielectric constant of a resin composition.
Collaborations
Koichiro Okamoto is identified as Harada’s coworker. The provided information does not specify their roles or the nature of their collaboration on the patent.
Conclusion
Ryosuke Harada’s listed patent addresses low-dielectric resin materials for semiconductor members through the use of hollow resin particles.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile