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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12674008 B1

PDFFull Text
Date of Patent:
Jul. 07, 2026

Filed:

Dec. 09, 2021

Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles

Applicant:

Sekisui Kasei Co., Ltd., Osaka, JP;

Inventors:

Haruhiko Matsuura, Osaka, JP;

Shinya Matsuno, Osaka, JP;

Assignee:

SEKISUI KASEI CO., LTD., Osaka, JP;

Attorney:

GREENBLUM & BERNSTEIN, P.L.C.

Primary Examiner:

Ronak C Patel

Int. Cl.
CPC ...
C08F 12/36 (2006.01); C09D 5/00 (2006.01); C09D 5/24 (2006.01); C09D 125/16 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
C08F 12/36 (2013.01); C09D 5/00 (2013.01); C09D 5/24 (2013.01); C09D 125/16 (2013.01); H01B 3/30 (2013.01);
Abstract

Provided is a hollow resin particle that has a shell portion and a hollow portion surrounded by the shell portion and that can achieve reductions in dielectricity and dielectric loss tangent and can exhibit excellent heat resistance. In addition, a method for producing such a hollow resin particle in a simple manner is provided. Furthermore, use of such a hollow resin particle is provided. A hollow resin particle according to an embodiment of the present invention is a hollow resin particle including a shell portion and a hollow portion surrounded by the shell portion, wherein the shell portion has an ether structure represented by formula (1).

Find Patent Forward Citations

Matsuura, Haruhiko. (2026). Hollow resin particles, method for producing hollow resin particles, and use of hollow resin particles (U.S. Patent No. 12674008). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12674008

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