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Trademarks = 1

Forward Citations = 0

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9 inventors (with patents filed for the assignee):

Koji Minamitani (3 out of 14 patents)

Kenji Yoshino (2 out of 7 patents)

Makoto Karatsu (1 out of 7 patents)

4. Yuji Minamibori (1 out of 12 patents)

5. Takashi Nagaoka (1 out of 6 patents)

6. Masanori Takeuchi (1 out of 1 patent)

7. Keitaro Kawakita (1 out of 1 patent)

8. Terutoshi Kumaki (1 out of 1 patent)

9. Keitaro Kawakita (1 out of 1 patent)

8 patents: Sort by Forward Citations

1. 12397531 - Packaging material (2025-08-26),

2. 12308452 - Laminated body for power storage device outer packaging material (2025-05-20),

3. 12214571 - Molding packaging material, power storage device packaging case, and power storage device (2025-02-04),

4. 12135173 - Heat exchanger (2024-11-05),

5. 12065591 - Packaging material for molding (2024-08-20),

6. 11858251 - Method of manufacturing laminated armoring material (2024-01-02),

7. 11788794 - Heat exchanger and inner fin thereof (2023-10-17),

8. 11633769 - Chassis for small electronic device and method for forming same, and rolled aluminum alloy laminated sheet material for chassis for small electronic device (2023-04-25),

Resonac Packaging Corporation is a leading provider of innovative packaging solutions for a wide range of industries. Our state-of-the-art facilities and team of experts ensure that we deliver high-quality products to our clients. With a focus on sustainability and customer satisfaction, we strive to exceed expectations in every project. Visit our website to learn more about our services and capabilities.

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USPTO Data Jan 1 1976 - Dec 2 2025

8 Patents

#2 in Hikone

#4,914 in Japan

Hikone, Japan

Resonac Packaging Corporation