Resonac Packaging Corporation, based in Hikone, Japan, specializes in advanced packaging solutions that cater to a variety of industries. The company focuses on developing innovative materials and technologies that enhance product protection and sustainability. With a commitment to research and development, Resonac is at the forefront of creating packaging that meets the evolving needs of global markets, emphasizing efficiency and environmental responsibility in its offerings.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Oct 13 2026

12 Patents

#2 in Hikone

#3,935 in Japan

#48,163 in the World

Hikone, Japan

Resonac Packaging Corporation

Forward Citations = 1

11 inventors:

Koji Minamitani (4 out of 15 patents)

Keitaro Kawakita (3 out of 3 patents)

Kenji Yoshino (2 out of 7 patents)

4. Yuji Minamibori (2 out of 13 patents)

5. Makoto Karatsu (1 out of 7 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Resonac Packaging Corporation. Retrieved from https://idiyas.com/company/resonac-packaging

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent (EPO):

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]