The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 2026
Filed:
Jun. 07, 2023
Resonac Packaging Corporation, Hikone, JP;
Naoya Koda, Tokyo, JP;
Resonac Packaging Corporation, Hikone, JP;
Abstract
A packaging material for a power storage device includes a laminated material. The laminated material is composed of a metal foil layer, a substrate layer provided on an outer surface side of the metal foil layer, and a heat-fusible resin layer provided on an inner surface side of the metal foil layer. The heat-fusible resin layer is arranged on an inner surface side of the packaging material. The heat-fusible resin layer is formed of a polyolefin-based film. Martens hardness HMs of the heat-fusible resin layer measured with a Berkovich indenter is in a range of 15 N/mmto 25 N/mm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile