IDiyas

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11858251 B1

PDFFull Text
Date of Patent:
Jan. 02, 2024

Filed:

Feb. 14, 2018

Method of manufacturing laminated armoring material

Applicant:

Showa Denko Packaging Co., Ltd., Isehara, JP;

Inventor:

Koji Minamitani, Minato-ku, JP;

Assignee:

RESONAC PACKAGING CORPORATION, Shiga, JP;

Attorney:

Keating & Bennett, LLP

Primary Examiner:

Samir Shah

Int. Cl.
CPC ...
B32B 7/14 (2006.01); B32B 7/05 (2019.01); B32B 37/00 (2006.01); B32B 37/02 (2006.01); B32B 37/12 (2006.01); B32B 15/08 (2006.01); B32B 27/32 (2006.01); B32B 27/34 (2006.01); B32B 27/36 (2006.01); B32B 27/40 (2006.01); B32B 38/10 (2006.01);
U.S. Cl.
CPC ...
B32B 7/14 (2013.01); B32B 7/05 (2019.01); B32B 15/08 (2013.01); B32B 27/32 (2013.01); B32B 27/34 (2013.01); B32B 27/36 (2013.01); B32B 27/40 (2013.01); B32B 37/0053 (2013.01); B32B 37/0076 (2013.01); B32B 37/02 (2013.01); B32B 37/1292 (2013.01); B32B 38/10 (2013.01); B32B 2250/03 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2307/306 (2013.01); B32B 2307/31 (2013.01); B32B 2310/0843 (2013.01); B32B 2311/12 (2013.01); B32B 2311/16 (2013.01); B32B 2311/22 (2013.01); B32B 2311/24 (2013.01); B32B 2323/04 (2013.01); B32B 2323/10 (2013.01); B32B 2367/00 (2013.01); B32B 2377/00 (2013.01); B32B 2571/02 (2013.01); Y10T 156/1082 (2015.01); Y10T 428/24851 (2015.01);
Abstract

In laminating resin layers on both surfaces of a metal foil layer by adhering a heat-resistant resin layer to a first surface of the metal foil layer and adhering a heat-sealable resin layer to a second surface thereof, as an adhering method, by employing an adhesive agent unapplied portion forming and adhering process in which the resin layer and the metal foil layer are adhered together by applying an adhesive agent to a region of a joining face of both the layers excluding a part of the region so that an adhesive agent unapplied section is formed, a laminated body having the adhesive agent unapplied section is manufactured. A resin layer removal process for removing a resin layer corresponding to the adhesive agent unapplied section of the laminated body to expose the metal foil layer is performed.

Find Patent Forward Citations

Loading…