The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Jan. 08, 2021
Resonac Packaging Corporation, Hikone, JP;
Keitaro Kawakita, Isehara, JP;
Yuji Minamibori, Isehara, JP;
Resonac Packaging Corporation, Hikone, JP;
Abstract
A packaging material for molding includes a heat resistant resin layer as an outer layer; a thermoplastic resin layer as an inner layer; a metal foil layer disposed between the heat resistant resin layer and the thermoplastic resin layer; a first adhesive layer disposed between the metal foil layer and the heat resistant resin layer; and a second adhesive layer disposed between the metal foil layer and the thermoplastic resin layer. The first adhesive layer is composed of a color adhesive agent composition containing a color pigment and an adhesive agent. The color adhesive agent composition contains a color pigment of 2 mass % or more and less than 5 mass % with respect to a solid component. The first adhesive layer is a coating of the color adhesive agent composition of 5 g/mto 10 g/m. The first adhesive layer contains a color pigment of 0.25 g/mto 0.49 g/m.