For the Inventor, By the Inventor

Enter assignee name

Milpitas, CA, United States of America

Nutool, Inc.

Calculating rank

USPTO Granted Patents = 47

% Expired Patents = 27.7

Forward Citations = 1,889

Loading Chart...

Loading Chart...

16 inventors (with patents filed for the assignee):

Homayoun Talieh (36 out of 104 patents)

Cyprian Emeka Uzoh (27 out of 432 patents)

Bulent Mehmet Basol (27 out of 161 patents)

4. Douglas W Young (12 out of 32 patents)

5. Konstantin Volodarsky (8 out of 23 patents)

6. Jalal Ashjaee (7 out of 23 patents)

7. Boguslaw Nagorski (4 out of 8 patents)

8. Rimma Volodarsky (4 out of 7 patents)

9. Paul G Lindquist (2 out of 6 patents)

10. Efrain A Velazquez (2 out of 9 patents)

11. Bernard M Frey (2 out of 3 patents)

12. Yuchun Wang (1 out of 31 patents)

13. Vulf Perlov (1 out of 2 patents)

14. Srinivasan M Komandur (1 out of 1 patent)

15. Mark Henderson (1 out of 1 patent)

Core Competencies:

Electrodeposition

Chemical Mechanical Polishing

Electrochemical Processing

Wafer Cleaning

Thin Film Deposition

Planarization

Semiconductor Substrate

Endpoint Detection

Material Removal

Proximity Plating

Anode Assembly

Polishing Apparatus

47 patents: Sort by Forward Citations

1. 6932896 - Method and apparatus for avoiding particle accumulation in electrodeposition (2005-08-23),

2. 6908374 - Chemical mechanical polishing endpoint detection (2005-06-21),

3. 6867136 - Method for electrochemically processing a workpiece (2005-03-15),

4. 6858121 - Method and apparatus for filling low aspect ratio cavities with conductive material at high rate (2005-02-22),

5. 6852208 - Method and apparatus for full surface electrotreating of a wafer (2005-02-08),

6. 6833063 - Electrochemical edge and bevel cleaning process and system (2004-12-21),

7. 6815354 - Method and structure for thru-mask contact electrodeposition (2004-11-09),

8. 6802946 - Apparatus for controlling thickness uniformity of electroplated and electroetched layers (2004-10-12),

9. 6797132 - Apparatus for plating and polishing a semiconductor workpiece (2004-09-28),

10. 6780772 - Method and system to provide electroplanarization of a workpiece with a conducting material layer (2004-08-24),

11. 6777338 - Edge and bevel cleaning process and system (2004-08-17),

12. 6773576 - Anode assembly for plating and planarizing a conductive layer (2004-08-10),

13. 6736929 - Distributed control system for semiconductor manufacturing equipment (2004-05-18),

14. 6722946 - Advanced chemical mechanical polishing system with smart endpoint detection (2004-04-20),

15. 6716084 - Carrier head for holding a wafer and allowing processing on a front face thereof to occur (2004-04-06),

Company Overview

Nutool, Inc., based in Milpitas, California, specializes in advanced technologies for semiconductor manufacturing. The company focuses on innovative solutions in electrodeposition, chemical mechanical polishing, and electrochemical processing, aimed at enhancing thickness uniformity and material removal efficiency. With a strong emphasis on planarization techniques and wafer processing, Nutool is dedicated to advancing the capabilities of semiconductor fabrication, contributing to the industry's evolution and the development of cutting-edge electronic devices.

Profile summary synthesized from public USPTO records and patent filings.

Company Badge

USPTO Data Jan 1 1976 - Nov 3 2026

47 Patents

#44 in Milpitas, CA

#1,756 in California

#7,452 in US

#14,841 in the World

Milpitas, CA, United States of America

Nutool, Inc.

Forward Citations = 1,889

16 inventors:

Homayoun Talieh (36 out of 104 patents)

Cyprian Emeka Uzoh (27 out of 432 patents)

Bulent Mehmet Basol (27 out of 161 patents)

4. Douglas W Young (12 out of 32 patents)

5. Konstantin Volodarsky (8 out of 23 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Nutool, Inc.. Retrieved from https://idiyas.com/company/nutool

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

Loading…