For the Inventor, By the Inventor

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Boise, ID, United States of America

Marian Corporation

USPTO Granted Patents = 2

Trademarks = 2

Forward Citations = 23

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5 inventors (with patents filed for the assignee):

Sven Evers (1 out of 25 patents)

Edward R Fix (1 out of 1 patent)

Douglas R Farnlund (1 out of 1 patent)

4. William J Witchger (1 out of 5 patents)

5. William Warren Becia (1 out of 3 patents)

2 patents: Sort by Forward Citations

1. 6817823 - Method, device and system for semiconductor wafer transfer (2004-11-16),

2. 6097602 - Integrated circuit package heat sink attachment (2000-08-01),

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USPTO Data Jan 1 1976 - Dec 30 2025

2 Patents

#100 in Boise, ID

#281 in Idaho

#92,662 in US

Boise, ID, United States of America

Marian Corporation

Forward Citations = 23

5 inventors:

Sven Evers (1 out of 25 patents)

Edward R Fix (1 out of 1 patent)

Douglas R Farnlund (1 out of 1 patent)

4. William J Witchger (1 out of 5 patents)

5. William Warren Becia (1 out of 3 patents)

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