Indianapolis, IN, United States of America

William J Witchger


Average Co-Inventor Count = 1.1

ph-index = 3

Forward Citations = 27(Granted Patents)


Company Filing History:


Years Active: 1981-2003

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5 patents (USPTO):Explore Patents

Title: The Innovative Contributions of William J Witchger

Introduction

William J Witchger is a notable inventor based in Indianapolis, IN (US). He has made significant contributions to the field of technology, holding a total of 5 patents. His work primarily focuses on advancements in integrated circuit packaging and thermal management solutions.

Latest Patents

Among his latest patents is the "Thin film mirror bond to plastic bead," which showcases his innovative approach to materials and their applications. Another significant patent is the "Integrated circuit package heat sink attachment." This invention describes an interface between an integrated circuit package and a heat sink, comprising a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer. This wafer is impregnated in a liquid-permeable mounting mesh sheet, which is sandwiched between two pressure-sensitive adhesive frames. These frames prevent the bleeding of the phase change material out of the space between the integrated circuit package and the heat sink. The methods of making this interface are also described in detail.

Career Highlights

William has worked with several companies throughout his career, including Mir-tec, LLC and Marian Corporation. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in his field.

Collaborations

One of his notable coworkers is Bruce J Donner, with whom he has collaborated on various projects. Their partnership has fostered a creative environment that has led to the development of impactful inventions.

Conclusion

William J Witchger's contributions to the field of technology through his patents and collaborations highlight his innovative spirit and dedication to advancing integrated circuit packaging solutions. His work continues to influence the industry and inspire future inventors.

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