Mir-tec, LLC

Other

Marian Corporation

Marian Rubber Products Company, Inc.

William J Witchger

Bruce J Donner

Thin film mirror bond to plastic bead

An interface between an integrated circuit package and a heat sink comprises a sandwich of a temperature-induced, solid-to-liquid phase-changing, thermally-conductive material wafer impregnated in a liquid-permeable mounting mesh sheet sandwiched between two pressure-sensitive adhesive frames also impregnating the sheet surrounding the wafer location. The adhesive impregnated sheet frame prevents bleeding of the phase change material out of the space between the integrated circuit package and the heat sink. Methods of making the interface are described.

Integrated circuit package heat sink attachment

A thin film mirror including a frame, a board, and a thin plastic film having a reflective metal deposit on one side thereof. The thin plastic film is pre-stretched over the frame and is secured thereto by an epoxy adhesive and a double-sided tape which prevents creep of the mirror during curing of the epoxy. The board is adhered to the reverse of the frame in order to protect the reflective surface of the mirror and to impart additional rigidity to the structure. Various embodiments of the thin film mirror are provided which employ an aperture to connect the air space formed between the mirror and the board with the atmosphere to thereby avoid any deformation of the mirror's surface due to atmospheric pressure changes. These various embodiments also include filter mechanisms to allow air flow but prevent debris from entering the air space. Various other embodiments incorporate an opaque tape disposed at and adhered to the periphery of the mirror to disguise any imperfections therein. In this way, a precise planar mirror surface may be fabricated that has all the advantages of a traditional glass mirror without the undesirable weight and fragility associated with those mirrors.

Thin film mirror and method

A marker device for merchandise items has blanks of high magnetic coercivity material spaced along a strip of high magnetic permeability material. The strip and blanks are the same width, produced from three ribbons of material, one ribbon of the high coercivity material, another of the high permeability material, and a third having a pressure sensitive adhesive surface in one process embodiment, and the third being a heat activated adhesive film in another process embodiment. The strip and blanks are thereby adhesively connected. Multiple strips of the marker devices are produced simultaneously by running adhesively connected ribbons through a gang of slitter knives.

Theft detection marker and method

Attachment of external electric supply lead wires to an electromagnetic coil assembly is done by a method using a harness base strip of resilient plastic insulating material having the two leads attached to the strip and the strip formed with a point and latching aperture portion for snapping onto the coil. The leads are twisted to the coil wire ends, soldered and laid flat against the outer face of the strip. A tailend portion of the strip is then wrapped over the soldered joints with subsequent taping, if desired.

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Indianapolis, IN, United States of America

William J Witchger