Boise, ID, United States of America

William Warren Becia


Average Co-Inventor Count = 5.1

ph-index = 3

Forward Citations = 22(Granted Patents)


Company Filing History:


Years Active: 2000-2004

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3 patents (USPTO):Explore Patents

Title: Innovations of William Warren Becia

Introduction

William Warren Becia is an accomplished inventor based in Boise, ID (US), known for his significant contributions to the field of semiconductor technology. With a total of three patents to his name, Becia has developed innovative solutions that enhance efficiency and functionality in semiconductor wafer processing.

Latest Patents

One of his latest patents is titled "Method, device and system for semiconductor wafer transfer." This invention relates to a wafer transfer system that achieves high efficiency, as measured by throughput rate. It combines reliable transfer of single wafers between ports while being simultaneously rotated to accomplish notch alignment. Another instance allows for simultaneous tilting of multiple wafers, such as changing the entire load of a transfer cassette between horizontal and vertical orientations, rather than operating on individual wafers serially. Furthermore, the design of this system renders it usable in both left-handed and right-handed workflow arrangements, achieving an economy of scale in production and inventory of the wafer transfer system itself.

Another notable patent is the "Multiple stage wet processing platform and method of use." This platform includes a sealable enclosure, at least two processing modules positioned within the enclosure, and an intra-module robot that moves between processing vessels. An inter-module robot is also positioned within the enclosure, allowing for efficient movement between modules.

Career Highlights

Throughout his career, William Warren Becia has worked with several prominent companies, including SCP Global Technologies, Inc. and Marian Corporation. His work has significantly impacted the semiconductor industry, particularly in the areas of wafer processing and transfer systems.

Collaborations

Becia has collaborated with notable professionals in his field, including Eric T. Hansen and Thomas Wayne Ives. These collaborations have contributed to the advancement of technology in semiconductor processing.

Conclusion

William Warren Becia's innovative patents and career achievements highlight his important role in the semiconductor industry. His work continues to influence the efficiency and effectiveness of wafer processing technologies.

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