For the Inventor, By the Inventor

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San Diego, CA, United States of America

Kyocera International, Inc.

USPTO Granted Patents = 19

EPO Patents = 1

Trademarks = 20

Forward Citations = 80

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28 inventors (with patents filed for the assignee):

Carlos Carceller (7 out of 7 patents)

Andy Piloto (7 out of 7 patents)

Kawthar A Zaki (7 out of 13 patents)

4. Ali Atia (7 out of 7 patents)

5. Joseph Tallo (7 out of 7 patents)

6. Tyler Reid (7 out of 7 patents)

7. James June-Ming Wang (3 out of 8 patents)

8. Mark Eblen (3 out of 4 patents)

9. Franklin Kim (2 out of 4 patents)

10. Shinichi Hira (2 out of 3 patents)

11. Yuh-Min Lin (2 out of 2 patents)

12. Ivan Ndip (1 out of 16 patents)

13. Klaus-Dieter Lang (1 out of 10 patents)

14. Arif Ege Engin (1 out of 1 patent)

15. Gerardo Aguirre (1 out of 4 patents)

19 patents: Sort by Forward Citations

1. 12355402 - Wideband amplifier linearization techniques (2025-07-08),

2. 12316391 - Phased-array antenna precision self-calibration (2025-05-27),

3. 12191817 - Peripheral for amplifier linearization with complimentary compensation (2025-01-07),

4. 12095181 - Antenna apparatus with integrated filter (2024-09-17),

5. 11942703 - Antenna array having antenna elements with integrated filters (2024-03-26),

6. 11677155 - Antenna apparatus with integrated filter (2023-06-13),

7. 11677154 - Antenna apparatus with integrated filter (2023-06-13),

8. 11469506 - Antenna apparatus with integrated filter (2022-10-11),

9. 11444381 - Antenna array having antenna elements with integrated filters (2022-09-13),

10. 11424543 - Antenna apparatus with integrated filter having stacked planar resonators (2022-08-23),

11. 11424053 - Ceramic feedthrough assemblies for electronic devices with metal housings (2022-08-23),

12. 11330699 - Non-overlapping power/ground planes for localized power distribution network design (2022-05-10),

13. 10410959 - Lead package and method for minimizing deflection in microelectronic packaging (2019-09-10),

14. 10236267 - Methods of forming flip chip systems (2019-03-19),

15. 9859185 - Semiconductor packaging structure and package having stress release structure (2018-01-02),

Kyocera International, Inc. is a leading global manufacturer of electronic components, industrial cutting tools, semiconductor packages, solar power generating systems, printers, copiers, and more. With a commitment to sustainability and innovation, Kyocera offers high-quality products that meet the needs of various industries. The company's advanced technology and expertise have made it a trusted partner for organizations around the world.

This text is generated by artificial intelligence and may not be accurate.

Company Badge

USPTO Data Jan 1 1976 - Dec 9 2025

19 Patents

#295 in San Diego, CA

#3,964 in California

#16,592 in US

#31,670 in the World

San Diego, CA, United States of America

Kyocera International, Inc.

Forward Citations = 80

28 inventors:

Carlos Carceller (7 out of 7 patents)

Andy Piloto (7 out of 7 patents)

Kawthar A Zaki (7 out of 13 patents)

4. Ali Atia (7 out of 7 patents)

5. Joseph Tallo (7 out of 7 patents)

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